Chemical vapour deposition (CVD) and plasma enhanced chemical vapour deposition (PECVD) are done in a special device developed at Limedion. In the classical CVD process a mostly volatile compound is fed to a hot surface, where it decomposes thermal. Very important in CVD is the gas flow and pumping management. The right am amount of reagent must be steady delivered to the hot reaction zone, but at the same time the not needed fraction of decomposed fragments must be pumped away to not disturb or hinder the further main reaction. Typically the precursors are metal halogenides, e.g. TiCl4, TaCl5, WF6 and thicknesses of the coatings can vary from 10 to 100 µm. The created halogen radicals can not just be pumped away, since they would cause serious damage to the pumps. Special freezing traps are used to extract and collect them before entering the pumps. PECVD is basically a CVD process, where the deposited material is fed to the normally hot reaction zone (sample surface) by a gas flow. Additionally to this process a plasma is ignited above the sample. The plasma ions can be actively participating in the CDV process to form e.g. oxides or nitrides or can just provide energy input to the reactive zone. Applying a additional bias to the sample can promote this process.